Samfurin buga allon da'ira RED solder abin rufe fuska ramukan castellated
Ƙayyadaddun samfur:
| Tushen Material: | Saukewa: FR4TG140 |
| Kauri PCB: | 1.0 +/- 10% mm |
| Ƙididdigar Layer: | 4L |
| Kaurin Copper: | 1/1/1/1 oz |
| Maganin saman: | ENIG 2U" |
| Mashin solder: | Ja mai sheki |
| Silkscreen: | Fari |
| Tsari na musamman: | Pth rabin ramukan akan gefuna |
Aikace-aikace
Ayyukan plated rabin ramukan sune:
1. Gudanar da ramin gefen rabi tare da kayan yankan V-dimbin yawa.
2. Hasashen na biyu yana ƙara ramukan jagora a gefen ramin, yana cire fatar tagulla a gaba, yana rage bursu, kuma yana amfani da masu yankan tsagi maimakon rawar jiki don inganta saurin gudu da sauke gudu.
3. A nutsar da tagulla don sanya wutan lantarki, ta yadda wani Layer na tagulla ya zama electroplated akan bangon rami na ramin zagaye da ke gefen allo.
4. Production na waje Layer kewaye bayan lamination, daukan hotuna, da kuma ci gaban da substrate a cikin jerin, da substrate ne hõre secondary jan karfe plating da kwano plating, sabõda haka, da jan karfe Layer a kan ramin bango na zagaye rami a gefen gefen. allon yana da kauri kuma an rufe murfin tagulla da murfin kwano don juriya na lalata;
5. Ƙirƙirar rabi-rami yanke ramin zagaye a gefen allon a rabi don samar da rabi;
6. A cikin mataki na cire fim din, an cire fim din anti-electroplating da aka danna yayin aikin fim din;
7. Etching da substrate an cire shi, kuma an cire tagulla da aka fallasa a saman Layer na ƙasa ta hanyar etching;
8. Ana cire tin ɗin da aka cire daga tin, don a iya cire tin da ke kan bangon rabin ramin, kuma a buɗe murfin tagulla a bangon rabin ramin.
9. Bayan ƙirƙirar, yi amfani da tef ɗin ja don haɗa allunan naúrar tare, kuma cire burrs ta hanyar layin etching na alkaline.
10. Bayan platin tagulla na biyu da tin a kan substrate, za a yanke ramin zagaye da ke gefen allo a rabi don ya zama ramin rabi, saboda murfin tagulla na bangon ramin yana rufe da tin Layer, da kuma Tagulla Layer na bangon rami ya cika tare da tagulla Layer na Layer na waje na Haɗin Substrate, wanda ya haɗa da ƙarfin haɗin gwiwa mai ƙarfi, zai iya hana shingen jan ƙarfe akan bangon rami yadda ya kamata daga cirewa ko ja da jan karfe lokacin yankan;
11. Bayan da rabin-rami forming da aka kammala, an cire fim din, sa'an nan kuma etched, don haka da cewa jan karfe surface ba za a oxidized, yadda ya kamata kauce wa faruwa na saura jan karfe ko ma gajeren kewaye, da kuma inganta yawan amfanin ƙasa kudi na metallized rabin. - rami PCB kewaye allon.
FAQs
Plated rabin-rami ko castellated-rami, shi ne gefu mai siffar tambari ta hanyar yankan cikin rabi akan faci.Plated rabin rami shine matakin mafi girma na gefuna da aka zana don allon da'ira da aka buga, wanda galibi ana amfani da shi don haɗin jirgi-zuwa-jirgi.
Ana amfani da Via azaman haɗin kai tsakanin yadudduka tagulla akan PCB yayin da PTH gabaɗaya ana yin girma fiye da vias kuma ana amfani dashi azaman rami mai ɗorewa don karɓar jagorar abubuwan - kamar waɗanda ba SMT resistors, capacitors, da kunshin DIP IC.Hakanan za'a iya amfani da PTH azaman ramuka don haɗin injina yayin da ba zai yiwu ba.
Plating akan ramukan jan karfe ne, madugu, don haka yana ba da damar tafiyar da wutar lantarki ta cikin jirgi.Wadanda ba a rufe ta cikin ramuka ba su da motsi, don haka idan kun yi amfani da su, za ku iya samun waƙoƙin tagulla masu amfani kawai a gefe ɗaya na allon.
Akwai nau'ikan ramuka guda 3 a cikin PCB, Plated through Hole (PTH), Non-Plated Through Hole (NPTH) da Via Holes, bai kamata waɗannan su ruɗe da Slots ko Yankewa ba.
Daga ma'aunin IPC, shine +/- 0.08mm don pth, da +/- 0.05mm don npth.
