Custom 4-Layer Black Soldermask PCB tare da BGA
Ƙayyadaddun samfur:
| Tushen Material: | Saukewa: FR4TG170+PI |
| Kauri PCB: | M: 1.8+/- 10% mm, sassauƙa: 0.2+/- 0.03mm |
| Ƙididdigar Layer: | 4L |
| Kaurin Copper: | 35um/25um/25um/35um |
| Maganin Sama: | ENIG 2U" |
| Mashin Solder: | Koren mai sheki |
| Silkscreen: | Fari |
| Tsari na Musamman: | M + sassauci |
Aikace-aikace
A halin yanzu, an yi amfani da fasahar BGA sosai a fagen kwamfuta (kwamfuta mai ɗaukar hoto, supercomputer, kwamfuta na soja, kwamfutar sadarwa), filin sadarwa (pagers, wayar hannu, modem), filin kera motoci (masu sarrafa injinan mota iri-iri, samfuran nishaɗin mota) .Ana amfani da shi a cikin nau'ikan na'urori masu amfani da yawa, waɗanda aka fi sani da su sune arrays, cibiyoyin sadarwa da masu haɗawa.Takamammen aikace-aikacen sa sun haɗa da walkie-talkie, mai kunnawa, kyamarar dijital da PDA, da sauransu.
FAQs
BGAs (Ball Grid Arrays) abubuwan SMD ne tare da haɗi a kasan ɓangaren.Ana ba da kowane fil tare da ƙwallon solder.Ana rarraba duk haɗin kai a cikin grid na saman ƙasa ko matrix akan ɓangaren.
Allolin BGA suna da ƙarin haɗin kai fiye da PCB na yau da kullun, ba da izini ga babban yawa, ƙananan ƙananan PCBs.Tun da fil ɗin suna ƙarƙashin allon allo, jagororin kuma sun fi guntu, suna samar da ingantaccen aiki da saurin aiki na na'urar.
Abubuwan BGA suna da dukiya inda za su daidaita kansu kamar yadda mai siyarwar ke yin ruwa kuma yana taurare wanda ke taimakawa tare da sanyawa mara kyau..Sa'an nan kuma za a yi zafi don haɗa jagora zuwa PCB.Ana iya amfani da dutse don kula da matsayin bangaren idan an yi saida da hannu.
Kunshin BGA suna bayarwamafi girma fil yawa, ƙananan thermal juriya, da ƙananan inductancefiye da sauran nau'ikan fakiti.Wannan yana nufin ƙarin fil ɗin haɗin haɗin gwiwa da haɓaka aiki a babban gudu idan aka kwatanta da fakitin layi-biyu ko lebur.BGA ba tare da rashin amfaninsa ba, kodayake.
BGA ICs sunewahalar dubawa saboda fil da aka ɓoye a ƙarƙashin kunshin ko jikin IC.Don haka dubawa na gani ba zai yiwu ba kuma de-soldering yana da wahala.The BGA IC solder hadin gwiwa tare da PCB kushin suna yiwuwa ga flexural danniya da gajiya da aka lalacewa ta hanyar dumama model a reflow soldering tsari.
Makomar Kunshin BGA na PCB
Saboda dalilai na ingancin farashi da dorewa, fakitin BGA za su yi fice sosai a kasuwannin samfuran lantarki da na lantarki a nan gaba.Bugu da ƙari, akwai nau'ikan fakitin BGA da yawa da aka haɓaka don biyan buƙatu daban-daban a cikin masana'antar PCB, kuma akwai fa'idodi masu yawa ta amfani da wannan fasaha, don haka da gaske muna iya tsammanin makoma mai haske ta amfani da kunshin BGA, idan kana da bukata, da fatan za a tuntube mu.
